Once again, according to Ming-Chi Kuo, Apple will avoid implementing its plans to use new resin-coated copper (RCC) components in the iPhone. At one point this change was heavily rumored to happen with the arrival of the iPhone 16 and save space inside the phone, then it was postponed for the iPhone 17 and now it’s being delayed again.
In his original report last October, Kuo explained that RCC can reduce the thickness of the main board (that is, it can save internal space) and facilitate the drilling process because it does not contain fiberglass.
Using RCC in the iPhone, however, has been a challenge for Apple and its suppliers due to concerns about durability and fragility. This again is said to be the reason for this latest delay.
“Due to its inability to meet Apple’s high quality requirements, the new iPhone 17 in 2025 will not use RCC as PCB motherboard material”Kuo wrote in a brief update on social media.
If Apple finally changes the iPhone’s main board to resin-coated copper, it will free up more internal space for the iPhone’s design, and who knows, maybe we’ll see huge batteries and of course better heat release!
(via)
Source: myphone.gr
