According to the manufacturing partners, the innovative placement of the cache opens the way to innovative constructions.
At the end of October, AMD unveiled the new 3D V-Cache design, which modified the original concept to the extent that the 3D V-Cache was not placed above the CPU chiplet, but below it, so that the cooling of the chip with higher heat production became more favorable. This is clearly visible in the clocks available for the Ryzen 7 9800X3D, which we also tested, and it looks like AMD is investigating several designs in the background to expand the possibilities.
At first, however, the company is still cautious, so in the case of the upcoming two-chip X3D Ryzens, a 64 MB 3D V-Cache chip will only be placed under one chiplet, but later it may appear under both chiplets, thus providing an extra 128 MB cache on a single encapsulation. Previously, AMD refrained from this because the clock signal had to be significantly reduced in order to optimize heat dissipation, but with the new configuration, even a relatively high clock signal can be realistically solved.
According to our information, the Ryzen Threadripper series will also receive an X3D edition in the Zen 5 round, but it has not yet been decided how many CPU chiplets will have 3D V-Cache chips.
Source: prohardver.hu
