Analyst Ming-Chi Kuo says Apple has again postponed its plans to use new resin-coated copper (RCC) components inside iPhones. This change, which was supposed tofree up internal space in the devicewas initially planned for the iPhone 16, then moved to the iPhone 17, and now further delayed.
In October, Kuo had explained that RCC can reduce the thickness of the motherboard and facilitate the drilling process, being free of glass fiber. However, implementing RCC has proven to be a challenge for Apple and its suppliers due to concerns about the durability and brittleness of the material.
Kuo has recently updated this report, talking about the inability of suppliers to meet Apple’s high quality standards. In practice, Even the 2025 iPhone 17 won’t use RCC as a motherboard material. In any case, if Apple were to eventually make the switch to RCC, it wouldn’t be a very visible change to the end user. Rather, it would free up internal space in the iPhone design, allowing Apple to make the devices thinner or use the extra space in other ways.
Kuo’s report doesn’t specify whether this change could happen with the iPhone 18 in 2026 or if it’s a longer delay. Apple’s constant pursuit of improving its products through technological innovations demonstrates its commitment to excellence, despite the technical challenges that arise along the way.
Rumor
Source: www.iphoneitalia.com
