Apple is constantly trying to miniaturize the components of its devices in order to be able to add new elements in the saved space.
Meanwhile, as reported by Ming-Chi Kuo, the American giant has abandoned the idea of using resin-coated copper in the motherboards in the iPhone 17.
The reason for this decision is the insufficient quality of this solution, which is why the quality requirements were not met. However, it is not known whether this technology will be improved by the time of the iPhone 18.
Resin-coated copper is a thin layer of copper foil coated with a resin, such as epoxy. The material would allow for a thinner logic board, which in turn would provide more space inside for other components and sensors in future iPhones.
It is worth recalling that there were earlier reports that Apple wants to introduce this solution to at least one of this year’s Apple Watch models.
Source: MacRumors
Source: myapple.pl
