For now, AMD is not planning a design similar to Lunar Lake

On paper, it’s a good idea to put the memory on the casing, but the manufacturing partners really don’t like it.

For the first time in years, Intel is putting on the table a particularly well-executed ultra-mobile design, which bears the code name Lunar Lake, and its major technical development is that it places the memory on the casing, specifically next to the processor. In relation to the system, the question arose as to when AMD would come up with something similar, which we have been asking about for the past few weeks, and those who expect it will be disappointed, as there are currently no plans for a similar construction on the other side.

Although AMD could solve it relatively easily, because it is not a very complicated encapsulation technology, they implement much more complex problems without any problems, e.g. 3D V-Cache. The problem is not the technological background, but the fact that notebook manufacturers really don’t like this design. Lunar Lake is tolerated for a round because it’s produced in very small quantities, so it doesn’t have much influence on the contracts between memory manufacturers and OEMs, which largely determine how much memory the companies involved have to buy in order to get word of mouth relatively cheaply. for rotating component. Lunar Lake, on the other hand, is a design in which the companies buy the memory directly from Intel, after all, it is there on the CPU casing, which means a quantitative drop in terms of the direct contract with the memory manufacturer.

Due to the above, AMD does not currently see much of a future in this from a purely business point of view, as it is a disadvantageous factor for manufacturers, so their partners would not have any serious buyers for a processor that delivers memory on the packaging anyway. For the same reason, Panther Lake, the successor to Lunar Lake, is made with a classic design, that is, in this new design, the memory moves back to the motherboard.