As we know, the new architecture-based processors Arrow Lake of Intel will also introduce, among the new features, the socket LGA 1851. However, The structure of the chip will also change, moving the hotspot to the north, potentially generating some cooling difficulties with some heat sinks.
As the famous overclocker and YouTuber pointed out Der 8auer on the forum Overclockthe new ones Intel Core Ultra 200 desktop they have a different physical structure from the latest generation Cores which moves the hottest point (hotspot) to the top of the chip.
As a rule, the so-called “hotspot” is located in the central area of the IHS. However, as we saw in the case of AMD, multichiplet designs move the CCDs to a more peripheral location. For this reason, some manufacturers offer staffe offset for Ryzen processors so as to allow their heatsinks to better cover the hottest area.
Something similar will also happen in the case of future Intel CPUs, characterized by a new “Tile” design that moves further nord l’hotspot. According to Der8auer, a reverse orientation of the heatsink (i.e. rotating it 180 degrees) risks considerably reduce cooling performance.
The problem does not arise so much with air coolers, but more with liquid ones (whether AIO or custom loop). Some of these solutions, in fact, have the liquid inlet hole in the upper part and the outlet hole in the lower part. Consequently, by rotating the block 180 degrees, the exit hole (i.e. where the hot liquid passes) would be located at the CPU hotspot.
At the moment, however, no manufacturer appears to offer offset brackets to optimize the performance of the heat sinks. In any case, the new socket remains perfectly compatible with the cooling systems already available on the market, but it cannot be ruled out that the accessories already available for the AMD counterparts will arrive together with the new CPUs.
Source: www.hwupgrade.it
