According to numerous reports so far, Apple intends to abandon the iPhone Plus line and replace it with a completely new model.
The latest information on this topic comes from one of the analysts. According to Ming-Chi Kuo, this device is to be even thinner than previously expected. At its thinnest point, the phone will be only 5.5 mm thick.
For comparison, the 11-inch iPad Pro is 5.3 mm thick and in the case of the larger model it is only 5.1 mm.
This phone can be made so thin, among other things, by removing the physical SIM card module. This means that the device will only support an eSIM card.
Source: 9to5Mac
Source: myapple.pl
