Faced with ever more efficient competition, Google’s “Tensor” chips have always struggled to keep up the comparison. The situation could change for its future smartphones, the company will abandon Samsung to turn to the giant TSMC.
The rumor had been circulating for several months now. New information revealed by Android Authority confirm that Google has made the switch to semiconductor giant TSMC to stay up to date.
An upgrade
A priori, there will be no 2nm engraving for the next Google Tensor G5 which should equip next year’s Pixel 10 series. According to Android Authority, the chip will be engraved on the 3nm N3E process at TSMC factories.
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This process corresponds to the same one used by Apple for the A18 Pro which equips the iPhone 16 pro with the M4. A healthy step forward for Google compared to the 4nm 4LPE process currently produced by Samsung and found in the Tensor G4.
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Hope for the future
Among the information retrieved by Android Authority includes information regarding the Google Pixel 11 and the Tensor G6 2026 codenamed “Malibu”. The latter would still respond to 3 nm engraving, but with N3P technology from TSMS that could be found for Apple’s A19 chip.
A table consulted by their teams includes elements of comparison with the N3E. With this new process, the chips will be able to gain nearly 5% in performance, or improve their energy consumption by almost 7%, all with a reduction in size of up to 4%.
Google seems to be preparing as best it can for the future for its Tensor chips while catching up with the competition on its technological gap.
Source: www.frandroid.com
