New GIGABYTE motherboards at CES

The new GIGABYTE motherboards have been presented at CES in response to the launch of new processing platforms from Intel and AMD. In both cases it is about expanding the existing offer (high-end versions) with new mid-range chipsets and initially to lower sales prices. We review the main new features and their features.

New GIGABYTE motherboards

The new generation of series motherboards Intel B860 y AMD B850 They have been designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors, taking advantage of AI-enhanced technology and with a simpler, easier to use and thermally improved design. According to the manufacturer, these plates “They are the gateway to mainstream PC gamers”.

The manufacturer will distribute a complete range of products with the new Intel and AMD chipsets, with different models to cover all needs and form factors from ATX to Mini-ITX. Of course, the company will offer all its technologies to obtain maximum performance and ease of use. The D5 Bionics Corsa suite that integrates software, hardware and firmware to increase performance; AI SNATCH to activate CPU or memory turbo mode with a simple click; HyperTune BIOS that includes AI-driven optimizations or solutions that aim to facilitate component mounting, PCIe EZ-Latch Plus and M.2 EZ-Latch Click.

GIGABYTE B860 (Intel)

The manufacturer takes as a starting point its current boards with Z890 chipset (a high-end also updated at CES) to offer the most advanced features possible in the mid-range at hand. It is worth remembering that, although the new desktop processors presented by Intel, the Core Ultra 200S (non-K), can be generally installed on all 800 series boards after updating the BIOS, the price of the high-end boards It is quite high and surely does not correspond to that of CPUs.

To cover that section, Intel has presented two new chipsets at CES, the mid-range (Intel B860) and the one intended for the entry range (Intel H810). The first is being the great objective of all the renewals that we have seen at CES among the large motherboard manufacturers (see ASUS, MSI, AsRock…) and of course GIGABYTE.

The new boards feature a fully digital power design and a first division thermal solution thanks to a unique heat sink that improves the cooling surface up to 4 times, combined with heat pipes and high thermal conductivity pads for superior efficiency in the always important cooling section.

Models with wireless connectivity option support the latest Wi-Fi 7 standards (with high-gain antennas) and Bluetooth 5.4, in addition to 2.5 GbE LAN. GIGABYTE bets on ease of use of your boards and component assemblyadding the WIFI EZ-Plug for quick and easy design for installing Wi-Fi antennas; EZ-Latch Plus for PCIe and M.2 slots with quick release and screwless design and the EZ-Latch Click for mounting M.2 heatsinks with screwless design.

The same can be said of support in AI technologiesthe Perfdrive that provides a preset personalized BIOS profile optimal for different user profiles or the AORUS AI SNATCH that allows you to improve performance and precisely adjust the speed of some components, such as DDR5 memory that can scale up to 9466 MT/s .

GIGABYTE will sell quite a few models with this chipset for the mid-range, B860 AORUS ELITE WIFI7 ICE, B860M AORUS PRO WIFI, B860I AORUS PRO ICE, B860M AORUS ELITE WIFI6E and its blank PCB equivalent, ICE.

GIGABYTE B850 (AMD)

The Taiwanese company can boast the highest sales share in X870 series motherboards due to full compatibility and comprehensive support of X3D Turbo mode for AMD Ryzen 7000X3DSeries and AMD Ryzen 9000X3D-Series processors. Now, it wants to follow those steps for mid-range chipsets and ensures that the new AORUS AI SNATCH software, which allows gamers Activate this Turbo mode instantly Without navigating complex UEFI settings, you’ll achieve gaming performance increases of up to 18%.

B850 series motherboards feature slots PCIe Gen 5 x16 full line for Gen 5 graphics cards and M.2 Gen 5 SSD connectors in multiple form factors, ensuring compatibility with a wide range of system configurations. Support for DDR5 memory has been expanded up to 8600 MT/s and wireless connectivity options include Wi-Fi 7 and Wi-Fi 6E, along with an innovative high-gain directional antenna from GIGABYTE.

He thermal and power design claims to be meticulously crafted, using premium materials and featuring ten times larger cooling surface heatsinks to ensure optimal performance and stability. The EZ-Debug zone centralizes debug LEDs and control buttons to provide a convenient and organized troubleshooting process, while the aforementioned EZ-Latch Plus offers tool-free installation for PCIe graphics cards, heatsinks or the M.2 SSD storage drives.

Among the offer of new GIGABYTE motherboards we see half a dozen models such as the B850 AI TOP, B850I AORUS PRO, B850 AORUS ELITE WIFI7 or the equivalents with PCB and components in a white finish (ICE series) that present a spectacular look. You can see all the models available in the manufacturer’s web portal.