Il Dimensity 9400 introduces an “all big” architecture, which renounces the so-called “little” cores usually present in SoCs, preferring instead a combination of more powerful cores. This chipset consists of:
- 1 core Cortex-X925
- 3 core Cortex-X4
- 4 core Cortex-A720
The architecture, which uses only large and ultra-large cores, was also seen on the predecessor Dimensity 9300 and the transition to cores A720 compared to A520 of the previous model represents a further leap in quality.
MediaTek points out that the Dimensity 9400 it is from 40% more efficient from an energy point of view compared to its predecessor, with an increase in performance equal to 35% in single-thread e al 28% in multi-thread.
Plus, memory support LPDDR5X, with speeds of up to 10.7 GB/s, it guarantees greater fluidity in daily operations and faster application management.
As for the graphics, Dimensity 9400 It is equipped with a GPU Immortal-G925which offers improved performance of the 41% and an increase in 40% in raytracing speed.
On the artificial intelligence front, the main innovation is the8th generation NPUdesigned to better manage the growing needs of generative AI. MediaTek also announced support for Google Gemini Nanoan AI platform that will improve AI processing on Android devices. The NPU is also 35% more efficient and until80% faster in responding to large language model (LLM) prompts. Furthermore, the chipset includes new technology AI Agentic Enginean AI framework that facilitates the implementation of custom AI engines by OEMs. Among the advanced capabilities offered by the NPU, stand out support for training LoRA directly on the device and the generation of high resolution videostwo features that are particularly relevant to generative AI.
As for the photography and videos, Dimensity 9400 is capable of supporting video 8K a 60 fps con HDR a 10-bit and full-range zoom, offering exceptional visual quality. This capability, combined with AI support, could allow OEMs to integrate innovative generative AI-based features directly into their devices.
Another important innovation of Dimensity 9400 is its upgraded 5G modem, which supports speeds up to 7 GB/s. Connectivity is further improved by a new Wi-Fi/Bluetooth combo chip made with a 4nm process, which guarantees lower energy consumption compared to the previous generation.
The chipset can power resolution displays WQHD+ a 180Hzmaking it ideal for smartphones with high-quality screens and high refresh rates. Additionally, MediaTek has added support MIPI for three-section foldable displays, underlining the company’s interest in future developments in the foldable device sector.
The first series of smartphones with the Dimensity 9400 will be available by the end of 2024, and expectations for this chipset are high, especially for high-end and foldable devices.
Source: www.androidiani.com
