The exact same problems are rumored to be facing Apple and Samsung regarding their work on the new Slim models which will appear next year. In short, there are two obstacles in the way of a thin phone: the motherboard and the battery.
After trials and disappointing results, Apple realizes there was a problem with the motherboard and abandons efforts to incorporate new battery technology. It stays with current materials and thus will overcome other problems such as volume production.
The end result will be an iPhone 17 Slim that will be about 6mm thick. For comparison, the iPhone 16 Plus is 7.8mm. The new Slim model is said to use a new OLED panel that will be 6.6” in size (down from 6.7” we had in the Plus version). Analyst Ming-Chi Kuo expects the Slim to account for 5 to 10 percent of iPhone shipments in 2025.
Meantime, the Samsung Galaxy S25 Slim will replace the S25 FE and will be a new design attempt by the company that could be adopted for the S26 series (if it proves popular). However, Samsung faced the same problems as Apple.
Mass production of thinner motherboards has reportedly been delayed due to supplier issues. However, progress has been made in using new materials for the battery. There is currently no indication of how thin the Galaxy S25 Slim will be, but to date the vanilla version of the S24 is considered to be the thinnest the South Koreans have to offer, with a thickness of 7.6 mm.
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Source: myphone.gr
